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Akasa A-ITX54-M1BV2, Rack, PC, Schwarz, Thin Mini-ITX, Kensington, 2.5"
Artikelnummer: [21315589] | Produzent: AKASA | Modell nummer: A-ITX54-M1BV2 | EAN: 4710679552934
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1U rack-mountable fanless case for commercial and industrial thin mini-ITX motherboards. Massive storage with four internal 2.5'' drives. Sleek design mixed with hi-dissipation thanks to the premium aluminum.
Added Support for Industrial Motherboards
Supported industrial motherboards:
- Asrock IMB-1233-WV
- Asrock IMB-1222
- Asrock IMB-1223
Premium Brushed Aluminium
Premium aluminium case for hi-heat dissipation and durability. Brushed finish for a sleek and stylish look.
Intel® LGA1700 Ready
Perfect for low-powered T-series Intel® Alder Lake processors up to 35W Thermal Design Point (TDP). Featuring an upgrade thermal module to cater for increased contact surface area and mounting pattern for LGA1700.
Abundance of Storage Space
Four internal 2.5" HDD/SSD mobile bays for plentiful storage capability.
Rack Mountable
Perfect for server, broadcasting and audiophile applications.
Low-Profile PCIe Expansion
Supports one low-profile PCIe card (x4).
Multiport USB Connection
Two front panel USB 3.2 Gen 1 and two USB 2.0 ports for added connectivity.
Superb Cooling Performance
Completely silent premium aluminium Thin Mini-ITX case with hi-efficient passive thermal module and hi-performance dual copper heatpipes. Transfers the heat from the processor to the fins on the exterior of the case, in order for the heat to be dissipated to the surroundings.
Space Saving
1U in profile height with volume of 5.2L
Express Your Branding & Identity
Optional bespoke engraving and colouring solutions to highlight and differentiate your fanless system solution. Requires a minimum order quantity - please talk to our Team about the different options available.
Added Support for Industrial Motherboards
Supported industrial motherboards:
- Asrock IMB-1233-WV
- Asrock IMB-1222
- Asrock IMB-1223
Premium Brushed Aluminium
Premium aluminium case for hi-heat dissipation and durability. Brushed finish for a sleek and stylish look.
Intel® LGA1700 Ready
Perfect for low-powered T-series Intel® Alder Lake processors up to 35W Thermal Design Point (TDP). Featuring an upgrade thermal module to cater for increased contact surface area and mounting pattern for LGA1700.
Abundance of Storage Space
Four internal 2.5" HDD/SSD mobile bays for plentiful storage capability.
Rack Mountable
Perfect for server, broadcasting and audiophile applications.
Low-Profile PCIe Expansion
Supports one low-profile PCIe card (x4).
Multiport USB Connection
Two front panel USB 3.2 Gen 1 and two USB 2.0 ports for added connectivity.
Superb Cooling Performance
Completely silent premium aluminium Thin Mini-ITX case with hi-efficient passive thermal module and hi-performance dual copper heatpipes. Transfers the heat from the processor to the fins on the exterior of the case, in order for the heat to be dissipated to the surroundings.
Space Saving
1U in profile height with volume of 5.2L
Express Your Branding & Identity
Optional bespoke engraving and colouring solutions to highlight and differentiate your fanless system solution. Requires a minimum order quantity - please talk to our Team about the different options available.