Thermaltake TG-30, Wärmeleitpaste, 4,5 W/m·K, Schwarz, 1 Stück(e)
FBAC4895-B52C-4E03-B099-A6A8F8B8017B Created with sketchtool. 706D6907-81E1-46A2-B8F9-7B702A1EF2C7 Created with sketchtool. 6A870209-E7F5-44F5-A66F-09E20C85A0DC Created with sketchtool. 0BB04D6C-A9AB-4913-BF4F-5A23954E68E1 Created with sketchtool. 501E26C7-66C1-4DAA-B740-6CFAF55A1B39 Created with sketchtool. C105F7D3-D5EE-43C9-9EE8-05CC42B296D4 Created with sketchtool. D94689D8-7CBB-41C8-AC06-F79D81FF82D5 Created with sketchtool. DA4C7ED9-2512-4D52-94F0-92800F2A6E04 Created with sketchtool. 42E133FD-828F-4CF4-A0BF-560014487A57 Created with sketchtool. F52D9745-4BFD-4506-BEEF-630FD09EF2D9 Created with sketchtool.
Externen Lager (5-7 Werktage)
Das Produkt befindet sich in einem externen Lager. Die Lieferfrist: ca. 5-7 Werktage.. Mehr Info
Versandoptionen  - Wird im Checkout ausgewählt
Versand mit DHL - PaketShop
3,57
Versand mit DHL zur Adresse
11,90
Versand mit GLS - PaketShop
9,16
Versand mit GLS zur Adresse
11,90
EUR 17,91
ex. MwSt. 15,05
Gesamtbetrag inkl. Versand. 21,48
TG-30 is a premium thermal compound for high standard cooling performance designed to lower CPU temperatures effectively.

High Thermal Conductivity
The thermal compound contains diamond powder, which would provide a thermal conductivity of 4.5 W/m-k that could fulfill the user’s primary needs.

Easy to Apply
Thermaltake’s specially formulated thermal compound fits perfectly with the honeycomb stencil, which provides an easier way to apply your thermal compound for a neat and well-covered surface that fits all CPUs.

All-In-One Application Kit
This thermal compound application kit includes a set of easily-applied tools for immediate use.

Sustainability and Safety
The high-quality thermal compound provides a longer lifespan of eliminating dry-out or cracking while in use.
Non-electrical conductive compound ensures better safety measures for you and your system.